DIGITAL-2021-CLOUD-AI-01-DATA-TECH
Secretariat for the Alliance on Processors and Semiconductor technologies -
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HORIZON-CL4-2024-DIGITAL-EMERGING-01-54
Smart photonics for joint communication & sensing and access everywhere (Photonics Partnership) (RIA)MOTIVATION The development of processors and semiconductor technologies aligns closely with the need for advanced digital infrastructure and emerging technologies under HORIZON-CL4-2024-DIGITAL-EMERGING-01-54. These technologies are foundational for AI, edge computing, and other digital advancements.
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DIGITAL-2025-AI-08-PROCESSOR
Support to the secretariat for the Alliance on Processors and Semiconductor TechnologiesMOTIVATION Continuation of support provided until the end of 2025 by allpros.eu
Call text (as on F&T portal)
View on F&T portalOutcome and Deliverables
The Secretariat of the Industrial Alliance will support the European Commission in delivering on the following outcomes:
A platform for identifying opportunities for leveraging investment and innovation synergies in the research, development and deployment of next generation of resource-efficient, interoperable, highly secure semiconductor technologies. This platform should enhance coherence and synergies across activities in the IPCEIs, the KDT JU, Digital Europe Programme and the Pact for Skills.
The European Commission will be an observer to the General Assembly, monitoring progress with a view to its policy and investment agenda and act as a facilitator towards cooperation and engagement of all stakeholders, e.g. by providing secretarial services for the on-boarding of new members
Objective:This action is to support the activities of the Industrial Alliance on processors and semiconductor technologies that was announced in the Communication on “Updating the 2020 New Industrial Strategy” The purpose of the Alliance is to gather relevant stakeholders, including industry, Member States representatives and other experts, from across Europe in view of strengthening Europe’s industrial capacities in the design and manufacturing of advanced processors and other electronic components. The activities of the Alliance will contribute to delivering on the EU’s digital targets for 2030, by addressing use cases for all sectors of the economy, notably mobility, communications, industrial manufacturing, security, and health.
Scope:The main tasks of the Alliance will include: identification of critical gaps in the semiconductor value chain, development of targets and roadmaps, increasing design and manufacturing capacities and leveraging investment and innovation synergies. Member States representatives are invited to participate in the work of the Alliance in relevant working groups. This action consists in providing the following support services to the Alliance:
- Supporting the work of the Alliance, including through the organisation of relevant thematic working groups in view of ensuring progress towards and delivering on the Alliance’s milestones.
- Organisation of the annual General Assembly with all members of the Alliance, in close coordination with the European Commission.
- Organisation of the annual Alliance Forum with all members of the Alliance and interested stakeholders, in close coordination with the European Commission.
- Creation and maintenance of the Alliance’s website and day-to-day content creation to inform the broader audience about the Alliance’s activities.
News flashes
FLFLASH INFORMATION ON THE CALL RESULTS (FLASH CALL INFO)
Call for proposals: Cloud Data and TEF
Call ID: DIGITAL-2021-CLOUD-AI-01
Published: 17/11/2021 Deadline: 22/02/2022
Total budget: 140.000.000 EUR
Budget per topic:
DIGITAL-2021-CLOUD-AI-01-DATA-TECH EUR 1.000.000
DIGITAL-2021-CLOUD-AI-01-DS-MARKETPLACE-CLOUD EUR 20.000.000
DIGITAL-2021-CLOUD-AI-01-FEI-DS-GENOMICS EUR 20.000.000
DIGITAL-2021-CLOUD-AI-01-INDUSTRIAL-DATA EUR 1.000.000
DIGITAL-2021-CLOUD-AI-01-PREP-AI EUR 1.000.000
DIGITAL-2021-CLOUD-AI-01-PREP-DS-GREEN-DEAL EUR 2.000.000
DIGITAL-2021-CLOUD-AI-01-PREP-DS-MANUFACT EUR 1.000.000
DIGITAL-2021-CLOUD-AI-01-PREP-DS-MOB EUR 1.000.000
DIGITAL-2021-CLOUD-AI-01-PREP-SMART-COMM EUR 1.000.000
DIGITAL-2021-CLOUD-AI-01-SUPPCENTRE EUR 14.000.000
DIGITAL-2021-CLOUD-AI-01-TEF-EDGE EUR 78.000.000
The Commission has now completed the evaluation of the proposals submitted to the above-mentioned call. The results by topic can be consulted under topic updates.
We recently informed the applicants about the evaluation results for their proposals.
It is expected that grant agreements will be signed by 22.11.2022.
Please note that the number of proposals that can finally be funded will depend on the finally available budget and the formal selection by the Commission.
Fo For further details please see the DIGITAL Europe Programme
The evaluation results of topic DIGITAL-2021-CLOUD-AI-01-DATA-TECH are shown below:
Number of proposals submitted: 2
Number of inadmissible proposals: 0
Number of ineligible proposals: 0
Number of above-threshold proposals: 2
Total budget requested for above-threshold proposals: 1.998.276,00 EUR
1. A total of 23 proposals were submitted under this call. Below the breakdown of number of proposals submitted per topic:
Topic
Submitted
DIGITAL-2021-CLOUD-AI-01-FEI-DS-GENOMICS
1
DIGITAL-2021-CLOUD-AI-01-DS-MARKETPLACE-CLOUD
2
DIGITAL-2021-CLOUD-AI-01-TEF-EDGE
2
DIGITAL-2021-CLOUD-AI-01-INDUSTRIAL-DATA
4
DIGITAL-2021-CLOUD-AI-01-DATA-TECH
2
DIGITAL-2021-CLOUD-AI-01-PREP-DS-MANUFACT
2
DIGITAL-2021-CLOUD-AI-01-PREP-SMART-COMM
2
DIGITAL-2021-CLOUD-AI-01-PREP-DS-MOB
3
DIGITAL-2021-CLOUD-AI-01-PREP-DS-GREEN-DEAL
3
DIGITAL-2021-CLOUD-AI-01-PREP-AI
1
DIGITAL-2021-CLOUD-AI-01-SUPPCENTRE
1
TOTAL
23
Publication date: 2021-11-16 (3 years ago)
Opening date: 2021-11-17 (3 years ago)
Closing date: 2022-02-22 (3 years ago)
Procedure: single-stage
Budget: 1000000
Expected grants: 0
This call topic has been appended 4 times by the EC with news.
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2022-06-20
 flflash information on the ca... -
2022-06-20
the evaluation results  of topic&#x... -
2022-03-04
1.       a... -
2021-11-17
the submission session is now available...
DIGITAL-2021-CLOUD-AI-01
Call topics are often grouped together in a call. Sometimes this is for a thematic reason, but often it is also for practical reasons.
There are 10 other topics in this call:
- DIGITAL-2021-CLOUD-AI-01-DS-MARKETPLACE-CLOUD
- DIGITAL-2021-CLOUD-AI-01-FEI-DS-GENOMICS
- DIGITAL-2021-CLOUD-AI-01-INDUSTRIAL-DATA
- DIGITAL-2021-CLOUD-AI-01-PREP-AI
- DIGITAL-2021-CLOUD-AI-01-PREP-DS-GREEN-DEAL
- DIGITAL-2021-CLOUD-AI-01-PREP-DS-MANUFACT
- DIGITAL-2021-CLOUD-AI-01-PREP-DS-MOB
- DIGITAL-2021-CLOUD-AI-01-PREP-SMART-COMM
- DIGITAL-2021-CLOUD-AI-01-SUPPCENTRE
- DIGITAL-2021-CLOUD-AI-01-TEF-EDGE
Showing the latest information. Found 4 versions of this call topic in the F&T portal.
Information from
- 2025-01-21_03-20-12
- 2025-01-18_03-20-14
- 2024-11-23_03-20-17
- 2024-03-30_14-26-55
Check the differences between the versions.
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