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Closed HORIZON-JU-CHIPS-2025-IA-HPA HORIZON

Heterogeneous Integration for High-Performance Automotive Computing

Call text (as on F&T portal)

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Expected Outcome:

Proposals are expected to encompass at least the following elements:

  • Automotive chiplet system framework: Develop and implement the architectural and design specifications for an automotive chiplet-based computing platform, taking into consideration any relevant standards and industry wide collaborations in this field.
  • Adaptation of relevant IP: Where necessary, adapt pertinent intellectual property (IP) to support seamless chiplet integration within the automotive context.
  • Automotive base die development: Development of an automotive base die for the orchestration of in-package computing with adequate process workflows.
  • System Integration and Packaging: integrate the system and develop the package taking into consideration automotive requirements.

    • Complementarity with the RISC-V Automotive Hardware Platform topic is expected. For the purposes of intermediate physical demonstrators, non-RISC-V based IP may be considered for in-package integration. Collaboration with the Chips for Europe Initiative pilot lines is encouraged. Nevertheless, the final deliverable for this project should include components developed under the RISC-V Automotive Hardware Platform call - particularly the application processor and AI accelerators - integrated with other IP via the chiplet platform developed under this call.

    News flashes

    2026-10-15
    The submission session is now available for: HORIZON-JU-CHIPS-2025-IA-HPA
    2026-10-15
    The submission session is now available for: HORIZON-JU-CHIPS-2025-IA-HPA
    call topic details
    Call status: Closed
    Opening date: 2025-03-04 (1 year ago)
    Closing date: 2025-04-30 (1 year ago)
    Procedure: single-stage

    Budget: 20,000,000
    Expected grants: 1
    Contribution: 1,000,000 - 20,000,000
    News flashes

    This call topic has been appended 2 times by the EC with news.

    • 2026-10-15
      the submission session is now available...
    • 2026-10-15
      the submission session is now available...
    Call

    HORIZON-JU-CHIPS-2025-IA-HPA

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    Source information

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    Information from

    • 2025-07-02_03-32-06
    • 2025-06-16_03-31-18
    • 2025-05-01_03-30-19
    • 2025-04-30_03-30-39
    • 2025-03-04_03-30-11

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    Events

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    1 upcoming

    Upcoming

    Dec 2 2026

    EFECS 2026

    in 48 days
    2 Dec - 4 Dec 2026 Helsinki, Finland

    Hosted at the 𝗠𝗲𝘀𝘀𝘂𝗸𝗲𝘀𝗸𝘂𝘀 𝗛𝗲𝗹𝘀𝗶𝗻𝗸𝗶 𝗘𝘅𝗽𝗼 𝗮𝗻𝗱 𝗖𝗼𝗻𝘃𝗲𝗻𝘁𝗶𝗼𝗻 𝗖𝗲𝗻𝘁𝗿𝗲, EFECS 2026 will gather Europe’s semiconductor and ECS community under the theme: “𝗦𝗲𝗺𝗶𝗰𝗼𝗻𝗱𝘂𝗰𝘁𝗼𝗿𝘀 𝗮𝘁 𝘁𝗵𝗲 𝗰𝗿𝗼𝘀𝘀𝗿𝗼𝗮𝗱𝘀: 𝗽𝗼𝗹𝗶𝘁𝗶𝗰𝗮𝗹 𝗽𝗼𝘄𝗲𝗿, 𝗶𝗻𝗱𝘂𝘀𝘁𝗿𝗶𝗮𝗹 𝘀𝘁𝗿𝗮𝘁𝗲𝗴𝗶𝗲𝘀 𝗮𝗻𝗱 𝗲𝗰𝗼𝗻𝗼𝗺𝗶𝗰 𝗴𝗿𝗼𝘄𝘁𝗵”.

    💡 What to expect:
    • High-level discussions on Europe’s semiconductor future
    • Insights into industrial strategy, resilience, innovation, and competitiveness
    • Networking with key stakeholders from across the ECS ecosystem
    • A full week of activities, side events, workshops, and community gatherings before and after the main forum

    More info

    Events are added by the ideal-ist NCP community and are hand-picked. Would you like to suggest an event? Contact idealist@ffg.at.

    Timeline

    Track where this call stands in its lifecycle, from work programme to grant signature, and see what's likely to happen next.

    Grant agreement signed · 30 Dec 2025 (9 months ago)

    All expected milestones for this call have passed.

    Today

    Work programme published

    04 Jan 2025 · est.

    Call published

    04 Mar 2025

    Call opens

    04 Mar 2025

    Call closes

    30 Apr 2025

    Outcome expected

    30 Sep 2025 · est.

    Grant agreement signed

    30 Dec 2025 · est.

    Preparation Open for submission Evaluation Grant preparation Not yet reached

    1. Work programme published Estimated

      04 Jan 2025 · 1 year ago

      Topics are listed in the Work Programme before the call opens. Spotting this early gives you a head start on partner search and proposal planning.

    2. Call published

      04 Mar 2025 · 1 year ago

      This topic was first published in TopicTree.

    3. Call opens

      04 Mar 2025 · 1 year ago

      Submissions can be made from this date.

    4. Call closes

      30 Apr 2025 · 1 year ago

      Deadline to submit a proposal.

    5. Outcome expected Estimated

      30 Sep 2025 · 1 year ago

      The maximum time to inform applicants of the evaluation outcome is five months after the call closes.

    6. Grant agreement signed Estimated

      30 Dec 2025 · 9 months ago

      The maximum time to sign the grant agreement is three months after applicants are informed of the outcome.

    Funded Projects

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    Project information comes from CORDIS (for Horizon 2020 and Horizon Europe) and will be sourced from F&T Portal (for Digital Europe projects)

    Ecosystem bubbles

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    1 bubble

    Chips / Micro- and Nanoelectronics

    This ecosystem bubble includes call topics from Horizon 2020, Horizon Europe and Digital Europe that focus on micro- and nanoelectronics. This also in...

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    Call document info

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