Closed HORIZON-JU-Chips-2024-1-IA-T3 HORIZON

Topic 3 Focus topic on “Service Oriented Framework for the Software Defined Vehicle of the future”

Call text (as on F&T portal)

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Scope:

Proposals need to particularly address the following aspects:

The open architectures and building blocks of the Software-define vehicle middleware and API framework developed under this project shall aim at exposing the vehicle's features and functionalities in the form of standard modular services and APIs, simplifying the development and certification of in-vehicle and edge-cloud applications, simplifying the access to vehicle data, functions and resources, making vehicle upgrades easier, simplifying the adoption of existing and new regulations, verification, validation and certification, and adding agility and speed to automotive engineering.

Layer-based solutions introducing a level of abstraction which allows the SDV middleware and API Layer framework to be independent from the automotive SDV Virtualization, OS and Hardware Abstraction Layer. The concept of hardware abstraction layers interface (HALI), which facilitates the integration and the decoupling of vehicle hardware from software, represents the foundation on which these solutions should be based. The reuse of results from the project focusing on building blocks around the HAL from the call HORIZON-KDT-JU-2023-2-RIA Topic 2 is envisioned.

Modular platforms based on the concept of standardised, interoperable and non-differentiating “building blocks”, based on open source components as far as appropriate, enabling in-vehicle and cloud-based applications and ensuring the integration and support of existing frameworks such as ECPLISE SDV, AUTOSAR Adaptive, COVESA, SOAFEE, digital.auto, etc. Modularity is fundamental to promote the evolution of a European platform for the SDV Vehicle of the Future.

Support the evolution towards domain- or vehicle-centralised E/E architectures, consolidating vehicle functions at domain-level (e.g., powertrain, autonomous driving, cockpit, body, OTA update, maintenance, …) with dedicated domain controllers, and simplifying the evolution toward zone- and vehicle-centralisation, with central control unit(s) running functions or services in and across different SW domains in a vehicle.

Ensure the coverage of safety and security, including secure access to on-board (and off-board) resources, features and services, and data provision, exploiting for example an increased use of virtualisation, software building blocks isolation, and defined (and possible also standardised) interfaces.

Building on the SDV Virtualization, OS and Hardware Abstraction Layer building blocks developed in related projects, development of reference implementations of the SDV Middleware and API framework for the SDV Vehicle of the Future in different scenarios of OEMs and TIERs. Reference implementations shall allow the concrete evaluation of the SDV platform with demonstrators.

Highly-automated engineering methods, tools and tool-chains using existing or developing missing engineering building blocks for toolsets, supporting the DEVOPS continuous approach and virtual engineering, including design, development, test, validation solutions to improve the efficiency, productivity, quality and trustability of the engineering process and keep it in the temporal constraints of the time to market of ADAS, AD, infotainment, sensing and control systems. Engineering process support should rely on existing solutions wherever possible, extended and/or complemented by newly developed methods, toolchains, and tools, when required (e.g. phases of the engineering process not covered, missing tools, improvement of existing tools, etc.). Building blocks are encouraged to be open-source wherever adequate.

The consortium should be coordinated by a leading European industrial actor of the automotive industry (OEM, tier-1), or by a neutral organisation well established in the automotive software sector. The consortium must include: 

a large and representative number of European OEMs of motorised vehicles (passenger cars, trucks, buses, motor cycles, off-road) with headquarters in several Member States of the European Union and/or its associated countries; 

a large and representative number of European tier-1 automotive suppliers and technology companies, including semiconductor companies and software engineering experts;

a representative number of tool providers specialized on the described engineering toolchains above;  

innovative SMEs across the value chain; 

leading universities and research and technology organisations bringing the newest advances in relevant digital and other technologies and/or acting act as neutral mediators. 

actors from across a significant number of Participating States of the Chips-JU program with a strong focus on the automotive sector.

Proposals are encouraged:

To allocate tasks to cohesion activities with the projects selected under the call HORIZON-KDT-JU-2023-3-CSA Topic 3 on Coordination of the European software-defined vehicle platform on and the call HORIZON-KDT-JU-2023-2-RIA Topic 2 on Hardware abstraction layer for a European Vehicle Operating System.

To allocate tasks to cohesion activities with the [call 2024 automotive HW?].

To allocate tasks to cohesion activities with the [related CCAM and 2ZERO projects].

To allocate tasks to cohesion activities with the [related national SDV projects]

News flashes

2024-03-20

Amendment to the WP

Please note that that the latest amendment of the Chips JU Work Programme 2023-2027 has been adopted. 

The following updates are introduced:

- Appendix 3 “Activities Launched in 2024 for the Non-Initiative Part.”

Ø  Section 2.3 “National Budgets for the call 2024”. The amount for some of the countries has been updated.

 

Ø  In-text Annex 4 to appendix 3: “Country specific eligibility rules” have been added for some countries and amended for a country.

The updated Appendix 3 v6 has already been published on the website, in the “Multiannual Programme 2023-2027   please check here : https://www.chips-ju.europa.eu/mawp/

2024-03-15

National Budget - CH

Please note for the Part C- National Budget,  Switzerland has requested the Swiss partners to fill out and submit the template provided by the Swiss funding authority (Chips JU Call 2024_Swiss Annex C)  with the proposals for the 2024 non-initiative Chips JU calls.

Any question related to the template needs to be addressed to the Swiss NFA.

 

You can find it in the Calls Document  here https://www.chips-ju.europa.eu/noninitiative/  

2024-02-20

Page limit:

Applications are subject to the page limits set out in the call conditions:

- The page limit for the chapter on EXCELLENCE is 60 pages for the PO Phase 

- The page limit for the chapter on IMPACT is 60 pages for the PO Phase 

- The page limit for the chapter on IMPLEMENTATION is 60 pages for the PO Phase 

All tables, figures, references and any other element pertaining to these sections must be included as an integral part of these sections and are thus counted against this page limit.

If you attempt to upload a proposal longer than the specified limit, the pages above the limit will not be taken into consideration for evaluation .

2024-02-06
The submission session is now available for: HORIZON-JU-Chips-2024-1-IA-T3(HORIZON-JU-IA), HORIZON-JU-Chips-2024-1-IA-T1(HORIZON-JU-IA), HORIZON-JU-Chips-2024-1-IA-T2(HORIZON-JU-IA)
call topic details
Call status: Closed
Opening date: 2024-02-06 (2 years ago)
Closing date: 2024-05-14 (2 years ago)
Procedure: two-stage

Budget: 20,000,000
Expected grants: 1
Contribution: 500,000 - 20,000,000
News flashes

This call topic has been appended 4 times by the EC with news.

  • 2024-03-20
    amendment to the wpplease note that that...
  • 2024-03-15
    national budget - chplease note for the...
  • 2024-02-20
    page limit: applications are subject to...
  • 2024-02-06
    the submission session is now available...
Call

HORIZON-JU-Chips-2024-1-IA

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Showing the latest information. Found 6 versions of this call topic in the F&T portal.

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  • 2025-11-20_06-39-22
  • 2025-10-28_15-53-39
  • 2025-07-02_03-33-06
  • 2024-11-23_03-30-16
  • 2024-07-04_15-02-04
  • 2024-03-30_14-17-49

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Upcoming

Dec 2 2026

EFECS 2026

in 48 days
2 Dec - 4 Dec 2026 Helsinki, Finland

Hosted at the 𝗠𝗲𝘀𝘀𝘂𝗸𝗲𝘀𝗸𝘂𝘀 𝗛𝗲𝗹𝘀𝗶𝗻𝗸𝗶 𝗘𝘅𝗽𝗼 𝗮𝗻𝗱 𝗖𝗼𝗻𝘃𝗲𝗻𝘁𝗶𝗼𝗻 𝗖𝗲𝗻𝘁𝗿𝗲, EFECS 2026 will gather Europe’s semiconductor and ECS community under the theme: “𝗦𝗲𝗺𝗶𝗰𝗼𝗻𝗱𝘂𝗰𝘁𝗼𝗿𝘀 𝗮𝘁 𝘁𝗵𝗲 𝗰𝗿𝗼𝘀𝘀𝗿𝗼𝗮𝗱𝘀: 𝗽𝗼𝗹𝗶𝘁𝗶𝗰𝗮𝗹 𝗽𝗼𝘄𝗲𝗿, 𝗶𝗻𝗱𝘂𝘀𝘁𝗿𝗶𝗮𝗹 𝘀𝘁𝗿𝗮𝘁𝗲𝗴𝗶𝗲𝘀 𝗮𝗻𝗱 𝗲𝗰𝗼𝗻𝗼𝗺𝗶𝗰 𝗴𝗿𝗼𝘄𝘁𝗵”.

💡 What to expect:
• High-level discussions on Europe’s semiconductor future
• Insights into industrial strategy, resilience, innovation, and competitiveness
• Networking with key stakeholders from across the ECS ecosystem
• A full week of activities, side events, workshops, and community gatherings before and after the main forum

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Grant agreement signed · 14 Jan 2025 (1 year ago)

All expected milestones for this call have passed.

Today

Work programme published

06 Dec 2023 · est.

Call opens

06 Feb 2024

Call closes

14 May 2024

Call published

30 Sep 2024

Outcome expected

14 Oct 2024 · est.

Grant agreement signed

14 Jan 2025 · est.

Preparation Open for submission Evaluation Grant preparation Not yet reached
  1. Work programme published Estimated

    06 Dec 2023 · 2 years ago

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  2. Call opens

    06 Feb 2024 · 2 years ago

    Submissions can be made from this date.

  3. Call closes

    14 May 2024 · 2 years ago

    Deadline to submit a proposal.

  4. Call published

    30 Sep 2024 · 2 years ago

    This topic was first published in TopicTree.

  5. Outcome expected Estimated

    14 Oct 2024 · 2 years ago

    The maximum time to inform applicants of the evaluation outcome is five months after the call closes.

  6. Grant agreement signed Estimated

    14 Jan 2025 · 1 year ago

    The maximum time to sign the grant agreement is three months after applicants are informed of the outcome.

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