Closed HORIZON-JU-Chips-2024-1-IA-T2 HORIZON

Topic 2 Focus topic on “High Performance RISC-V Automotive Processors supporting SDV”

Call text (as on F&T portal)

View on F&T portal
Scope:

In automotive industry, being no exception from general CPS development trends, SW requirements and HW implementations change over time, which poses a need for an automated process to continuously evaluate different HW SoCs under changing SW requirements. The SDV paradigm provides an efficient mechanism to decouple HW from SW development while preserving system’s integrity and ensuring the propagation of functional and non-functional specifications across system’s abstraction layers. The key role for this decoupling of design concerns is attributed to the HAL in the SDV abstraction model. This focus topic assumes a collaborative agreement with representative European stakeholders on a reference HAL and targets an efficient hardware implementation of the latter based on RISC-V. Proposals need to particularly address but are not limited to the following hardware design aspects:

Sound tool-agnostic collaboration infrastructure based on joint APIs for automating the continuous assessment process and DSLs for iterating over different HW configurations. This infrastructure promotes and enables new flexible RISC-V based solutions for existing and new use-cases. The planned infrastructure will allow fast and seamless comparison to existing solutions in the different design phases.

Open high-performance RISC-V based automotive processor reference architecture, which can lead to customized instantiations towards specific automotive needs and control domains, including e.g. a superscalar architecture. It should also include a fast context switch with multi-threading support and fast deterministic interrupt/execution response.

Integrated vector unit(s) including custom extensions as e.g. DSP, AI, networking, etc. These should be scalable with chained registers and out-of-order execution.

Co-processor interface for special VPU and accelerators

Safety and security elements, extended to memory and interconnect. This should include spatial and temporal redundancy for temporary and permanent faults and ASIL certification. Security features should include secure enclave and potentially execution guard. Focus should also be on micro-architectural protection for side-channel attacks and SESIP certifications.

Exploration of different on-chip and off-chip interconnect solutions based on existing SotA (e.g. AMBA) or new developments (e.g. chiplets)

Virtualization support with Hypervisor.

Definition and adoption of standardised data formats, interfaces (APIs) and improved interoperability.

Mechanisms to capture and manage, from the software level, fuctional as well as non-functional characteristics of possible integration with SDV modules with particular focus on real-time operation, low power dissipation, handling of (precise) computational exceptions and interrupts.

Benchmarks and workloads for incremental hardware development. These must be usable on COTS HW, FPGA prototypes, simulators as well as emulators and must be also applicable for bare-metal and to top of full SW stacks, including hypervisors and RTOS. Multiple levels of incremental evaluations should be also supported. Finally, a trade-off between representativeness of the software and confidentiality constraints must be made.

Although the development of design software and tools is not a primary subject of this focus topic, efforts and resources needed to develop software enabling or facilitating the design of any of the essential elements of the hardware platform shall be eligible for funding

The consortium should be coordinated by a leading European industrial actor of the automotive industry value chain, or by a neutral organisation well established in the sector . The consortium must include: 

a representative number of European semiconductor companies with headquarters in several Member States; 

a representative number of European tier-1 automotive suppliers and technology companies with headquarters in several Member States;

a representative number of European OEMs of motorised vehicles (passenger cars, trucks, buses, motor cycles) with headquarters in several Member States; 

innovative SMEs across the value chain; 

universities and research and technology organisations bringing the newest advances in relevant digital and other technologies and/or acting act as neutral mediators. 

Proposals are encouraged:

To allocate tasks to cohesion activities with the projects selected under the call HORIZON-KDT-JU-2023-3-CSA Topic 3 on Coordination of the European software-defined vehicle platformon and the call HORIZON-KDT-JU-2023-2-RIA Topic 2 on Hardware abstraction layer for a European Vehicle Operating System.

To allocate tasks to cohesion activities with the projects selected under the previous calls HORIZON-KDT-JU-2021 and -2022 (TRISTAN & ISOLDE)

To allocate tasks to cohesion activities with the [call 2024 SDV].

To allocate tasks to cohesion activities with the [related CCAM and 2ZERO projects].

News flashes

2024-03-20

Amendment to the WP

Please note that that the latest amendment of the Chips JU Work Programme 2023-2027 has been adopted. 

The following updates are introduced:

- Appendix 3 “Activities Launched in 2024 for the Non-Initiative Part.”

Ø  Section 2.3 “National Budgets for the call 2024”. The amount for some of the countries has been updated.

 

Ø  In-text Annex 4 to appendix 3: “Country specific eligibility rules” have been added for some countries and amended for a country.

The updated Appendix 3 v6 has already been published on the website, in the “Multiannual Programme 2023-2027   please check here : https://www.chips-ju.europa.eu/mawp/

2024-03-15

National Budget - CH

Please note for the Part C- National Budget,  Switzerland has requested the Swiss partners to fill out and submit the template provided by the Swiss funding authority (Chips JU Call 2024_Swiss Annex C)  with the proposals for the 2024 non-initiative Chips JU calls.

Any question related to the template needs to be addressed to the Swiss NFA.

 

You can find it in the Calls Document  here https://www.chips-ju.europa.eu/noninitiative/  

2024-02-20

Page limit:

Applications are subject to the page limits set out in the call conditions:

- The page limit for the chapter on EXCELLENCE is 60 pages for the PO Phase 

- The page limit for the chapter on IMPACT is 60 pages for the PO Phase 

- The page limit for the chapter on IMPLEMENTATION is 60 pages for the PO Phase 

All tables, figures, references and any other element pertaining to these sections must be included as an integral part of these sections and are thus counted against this page limit.

If you attempt to upload a proposal longer than the specified limit, the pages above the limit will not be taken into consideration for evaluation .

2024-02-06
The submission session is now available for: HORIZON-JU-Chips-2024-1-IA-T3(HORIZON-JU-IA), HORIZON-JU-Chips-2024-1-IA-T1(HORIZON-JU-IA), HORIZON-JU-Chips-2024-1-IA-T2(HORIZON-JU-IA)
call topic details
Call status: Closed
Opening date: 2024-02-06 (2 years ago)
Closing date: 2024-05-14 (2 years ago)
Procedure: two-stage

Budget: 20,000,000
Expected grants: 1
Contribution: 500,000 - 20,000,000
News flashes

This call topic has been appended 4 times by the EC with news.

  • 2024-03-20
    amendment to the wpplease note that that...
  • 2024-03-15
    national budget - chplease note for the...
  • 2024-02-20
    page limit: applications are subject to...
  • 2024-02-06
    the submission session is now available...
Call

HORIZON-JU-Chips-2024-1-IA

Call topics are often grouped together in a call. Sometimes this is for a thematic reason, but often it is also for practical reasons.

There are 2 other topics in this call:

Source information

Showing the latest information. Found 6 versions of this call topic in the F&T portal.

Information from

  • 2025-11-20_06-39-22
  • 2025-10-28_15-53-39
  • 2025-07-02_03-33-05
  • 2024-11-23_03-30-16
  • 2024-07-04_15-02-04
  • 2024-03-30_14-17-46

Check the differences between the versions.

Annotations

You must be logged in to add annotations
No annotations yet

Events

Hand-picked events relevant to this call topic.

1 upcoming

Upcoming

Dec 2 2026

EFECS 2026

in 48 days
2 Dec - 4 Dec 2026 Helsinki, Finland

Hosted at the 𝗠𝗲𝘀𝘀𝘂𝗸𝗲𝘀𝗸𝘂𝘀 𝗛𝗲𝗹𝘀𝗶𝗻𝗸𝗶 𝗘𝘅𝗽𝗼 𝗮𝗻𝗱 𝗖𝗼𝗻𝘃𝗲𝗻𝘁𝗶𝗼𝗻 𝗖𝗲𝗻𝘁𝗿𝗲, EFECS 2026 will gather Europe’s semiconductor and ECS community under the theme: “𝗦𝗲𝗺𝗶𝗰𝗼𝗻𝗱𝘂𝗰𝘁𝗼𝗿𝘀 𝗮𝘁 𝘁𝗵𝗲 𝗰𝗿𝗼𝘀𝘀𝗿𝗼𝗮𝗱𝘀: 𝗽𝗼𝗹𝗶𝘁𝗶𝗰𝗮𝗹 𝗽𝗼𝘄𝗲𝗿, 𝗶𝗻𝗱𝘂𝘀𝘁𝗿𝗶𝗮𝗹 𝘀𝘁𝗿𝗮𝘁𝗲𝗴𝗶𝗲𝘀 𝗮𝗻𝗱 𝗲𝗰𝗼𝗻𝗼𝗺𝗶𝗰 𝗴𝗿𝗼𝘄𝘁𝗵”.

💡 What to expect:
• High-level discussions on Europe’s semiconductor future
• Insights into industrial strategy, resilience, innovation, and competitiveness
• Networking with key stakeholders from across the ECS ecosystem
• A full week of activities, side events, workshops, and community gatherings before and after the main forum

Events are added by the ideal-ist NCP community and are hand-picked. Would you like to suggest an event? Contact idealist@ffg.at.

Timeline

Track where this call stands in its lifecycle, from work programme to grant signature, and see what's likely to happen next.

Grant agreement signed · 14 Jan 2025 (1 year ago)

All expected milestones for this call have passed.

Today

Work programme published

06 Dec 2023 · est.

Call opens

06 Feb 2024

Call closes

14 May 2024

Call published

01 Oct 2024

Outcome expected

14 Oct 2024 · est.

Grant agreement signed

14 Jan 2025 · est.

Preparation Open for submission Evaluation Grant preparation Not yet reached
  1. Work programme published Estimated

    06 Dec 2023 · 2 years ago

    Topics are listed in the Work Programme before the call opens. Spotting this early gives you a head start on partner search and proposal planning.

  2. Call opens

    06 Feb 2024 · 2 years ago

    Submissions can be made from this date.

  3. Call closes

    14 May 2024 · 2 years ago

    Deadline to submit a proposal.

  4. Call published

    01 Oct 2024 · 2 years ago

    This topic was first published in TopicTree.

  5. Outcome expected Estimated

    14 Oct 2024 · 2 years ago

    The maximum time to inform applicants of the evaluation outcome is five months after the call closes.

  6. Grant agreement signed Estimated

    14 Jan 2025 · 1 year ago

    The maximum time to sign the grant agreement is three months after applicants are informed of the outcome.

Funded Projects

Loading...

Project information comes from CORDIS (for Horizon 2020 and Horizon Europe) and will be sourced from F&T Portal (for Digital Europe projects)

Call document info

This section will come soon and contain the scraped information from the call document, such as the expected impact, scope, and other relevant sections. In the meantime, you can find this information in the call text section or directly on the F&T portal. View on F&T portal